Most specification arguments between an LED supplier and a fixture designer are not really arguments about physics. They are arguments about vocabulary. Two engineers say “bin” and mean different things; one says “lifetime” and means L70 while the other means the warranty period. This glossary collects the terms that appear in QUEENDOM datasheets, qualification reports and incoming inspection documents, defined the way our component engineering group uses them in writing. Every entry is written to be usable in a purchase order, not just readable, and where a term has a standard behind it the revision number is given.
1. Package and chip terms
Package vocabulary decides the manufacturing process long before it decides the optics. The package geometry sets the reflow profile, the stencil aperture, the pick-and-place nozzle and the inspection method, and in a high-volume line those choices are harder to reverse than the choice of LED die.
| Term | Definition | Where it matters |
|---|---|---|
| SMD | Surface-mount device. An LED whose terminals are soldered to pads on the board surface rather than through holes. | Reflow profile, pad geometry, thermal via design |
| CSP | Chip-scale package. A package whose footprint is close to the bare die area, typically under 1.2 times the die in each dimension. | High-density arrays where board area is the constraint |
| COB | Chip-on-board. Multiple dies mounted directly on a substrate and covered with a single phosphor layer. | High-flux luminaires, uniform emitting surface |
| PLCC | Plastic leaded chip carrier. A package with a moulded plastic body and metal leads, common in 3528, 3535 and 5050 sizes. | General indication and backlighting |
| Flip-chip | A die mounted face-down so light exits through the sapphire substrate and no wire bond shadows the emitting area. | Very high current density, automotive forward lighting |
| Die | The semiconductor chip itself, before packaging and phosphor conversion. | Bin definition, thermal resistance chain |
| Dominate wavelength | Peak of the spectral power distribution for a monochromatic LED, reported in nanometres. | Colour sorting for RGB and signalling |
| Peak wavelength | The single wavelength of maximum spectral power. | UV and IR emitter selection |
| Bond wire | The fine gold or copper wire that connects the die top contact to the package lead frame. | A shock and vibration failure path in automotive and industrial use |
| Moulding compound | The epoxy or silicone body that encapsulates the die and the bond wires. | Silicone resists UV and heat better than epoxy, which matters above 1 W |
| Lead frame | The metal structure that carries the die and forms the solder terminals. | Plating quality drives sulfurization resistance |
| Substrate | The ceramic or metal core board under a high-power or COB emitter. | Aluminium nitride and alumina sets the thermal resistance floor |
| Reflow profile | The time and temperature schedule that melts solder paste to attach the package. | Peak temperature is capped by the package moisture sensitivity level |
| MSL | Moisture sensitivity level, the floor time a package may spend out of dry storage before baking is required. | Popcorning cracks at reflow if the level is exceeded |
2. Electrical terms
The electrical vocabulary is small, but two of the entries below cause more field failures than any other single term: forward voltage and thermal resistance. Both are distributions rather than points, and both are quoted at a test condition that the application may not match.
| Term | Definition | Typical value |
|---|---|---|
| Forward voltage (Vf) | Voltage across the LED at a stated forward current and junction temperature. | 2.8 – 3.4 V for white and blue at 60 mA |
| Forward current (If) | Continuous current the LED is specified to carry. | 20 mA nominal for 20 mA-class SMD chips |
| Reverse leakage | Current that flows when the LED is reverse biased below its breakdown voltage. | Under 10 microamps at -5 V |
| ESD withstand | Human-body-model voltage the package survives without a forward voltage shift. | 2 kV HBM for standard SMD |
| Thermal resistance (Rth j-sp) | Junction to solder point thermal resistance, the number that links drive current to junction temperature. | 8 – 15 K/W for 3535 ceramic |
| Derating | The reduction in permitted current as ambient or solder point temperature rises. | Published as a curve or a linear derating factor |
| Binning current | The exact current at which luminous flux and forward voltage were measured for the bin. | Often 60 mA or 150 mA depending on package size |
| Drive current | The current the application actually applies, which may differ from the binning current. | Re-read the flux table at the application current |
| Pulsed operation | Drive with a low duty cycle and short pulse width, used to measure high currents without heating the die. | The basis of peak current claims in RGB and IR datasheets |
| Constant current driver | A driver that holds output current fixed and lets output voltage float within a compliance window. | Preferred once a branch carries more than three or four LEDs |
| Constant voltage driver | A driver that holds output voltage fixed; current is set by series resistance or an internal regulator. | Simplest topology, worst current spread across bins |
3. How binning actually works
Binning is the process of measuring production parts and sorting them into discrete groups with a narrow spread on one parameter. Three axes are used for white LEDs: luminous flux, forward voltage and chromaticity. A reel is described by one code from each axis, so a full part number carries three bin letters or numbers plus the package and CRI designation. Two parts that look the same in a catalogue can therefore be four bins apart and behave differently in a fixture that drives them hard.
Two consequences follow from this chart. First, the yield from a production run is not uniform; the peak of the distribution sits two bins above the minimum, so a buyer who orders the lowest bin is ordering the tail of the distribution and may face allocation pressure. Second, the forward voltage spread within one bin is still wide enough to matter if you drive LEDs from a fixed voltage rail with a single series resistor. That is why constant-current drivers are preferred once the branch count exceeds a handful.
A third consequence is commercial rather than technical. When a specification names only a nominal flux, the supplier is free to allocate any of several adjacent bins, and this is the single most common source of a first-article dispute. Naming the bin code, and accepting a stated tolerance around it, removes the ambiguity before the order is placed. Where a design cannot accept the full bin range, request a sub-bin or pay for the sorting; both are legitimate commercial options and both should be written into the agreement rather than assumed.
4. Reliability and lifetime terms
The reliability vocabulary is the one most often misused in marketing copy. An LM-80 report is a measurement; a TM-21 projection is a model fitted to that measurement; an L70 figure is the output of the model. Each step adds an assumption, and a comparison between two suppliers is only valid if the assumptions match.
| Term | Definition | Standard basis |
|---|---|---|
| LM-80 | Test method for measuring lumen maintenance of LED packages, arrays and modules at three case temperatures over at least 6000 hours. | IES LM-80-21 |
| TM-21 | Method that projects LM-80 data beyond the test duration to a target hour count. | IES TM-21-19 |
| L70 / L80 / L90 | The hours at which the light output falls to 70, 80 or 90 percent of the initial value. | Projected by TM-21 from LM-80 data |
| Lumen maintenance | Retained luminous flux at a given time and condition, expressed as a percentage of initial. | LM-80 measured points |
| Sulfurization | Silver-plated lead discolouration caused by sulphur compounds in the ambient, which raises contact resistance and drops flux. | Internal qualification and field return analysis |
| Thermal cycling | Repeated excursion between low and high temperature to expose solder joint and die-attach fatigue. | JESD22-A104 |
| High-temperature operating life | Continuous operation at elevated temperature to accelerate wear-out mechanisms. | JESD22-A108 |
| PPF / PPFD | Photosynthetic photon flux (micromoles per second) and its density (micromoles per second per square metre). | ANSI/ASABE S640 |
| Interpolation vs extrapolation | Reading between two measured points versus projecting beyond the last one. Only the first is a measurement. | TM-21 restricts how far a projection may run beyond the data |
| Accelerated life test | A test run above the rated condition so that failures appear in a practical time window. | Needs a validated acceleration model to translate back |
| Field return analysis | Teardown and measurement of parts that failed in service, the only true check on an accelerated test. | Feeds the next qualification revision |
| Weibull distribution | The statistical model most often fitted to time-to-failure data to estimate a population failure rate. | Distinguishes infant mortality from wear-out |
The practical reading of this pair of charts is that the lifetime number on a datasheet is a conditional statement, not a property of the LED. Change the drive current or the thermal path and the same part number delivers a different L70. When comparing two suppliers, compare the test current and case temperature as well as the projected hours, or the comparison is meaningless.
5. Colour and optical terms
Colour terminology contains a trap that catches even experienced buyers: a single averaged index conceals the one sample that matters most. The average is useful for a broad comparison and useless for retail, hospitality and broadcast applications where the red rendering of skin, food and fabric is the point of the specification.
| Term | Definition | Notes |
|---|---|---|
| CRI (Ra) | Colour rendering index averaged over eight test colour samples, scaled so a reference illuminant scores 100. | Use R9 separately; it is not part of Ra |
| R9 | Rendering score for a saturated red sample, the sample most LED phosphor systems fail. | Retail and hospitality specifications commonly demand R9 above 50 |
| CCT | Correlated colour temperature, the temperature of the blackbody whose colour is nearest the source. | 2700 K to 6500 K for general lighting |
| SDCM | Standard deviation of colour matching, the radius of the ellipse on the chromaticity diagram within which parts are accepted. | 3-step is the usual retail grade |
| Chromaticity | The x, y coordinate of the source on the CIE 1931 diagram. | Bin definitions are polygons in this space |
| MacAdam ellipse | The contour of just-noticeable colour difference around a target point. | Quadrangles are fitted inside a chosen ellipse |
| Radiant flux | Total optical power emitted, in watts, without weighting for human vision. | The correct metric for UV, IR and horticultural emitters |
| Photon efficacy | Micromoles of photons per joule of input energy. | The horticultural equivalent of lumens per watt |
| Beam angle | The included angle at which intensity falls to half its peak value. | Related to, but not the same as, the viewing angle of a bare emitter |
| Colour shift over life | Drift in chromaticity as the phosphor and the die age at different rates. | Quoted as a delta uv limit alongside the lumen figure |
| Flicker percent | Modulation depth of the light output under an AC-derived drive. | Relevant for camera capture, not only for visual comfort |
| Photobiological safety | The classification of a source by the risk it poses to skin and eyes. | IEC 62471 assigns the risk group |
6. Terms that are commonly confused
The entries below are the pairs that generate the most support tickets and the most wasted design effort, because in each case the two terms are close enough to be used interchangeably in conversation and far enough apart to change the outcome of a design or a contract.
| Term A | Term B | The distinction |
|---|---|---|
| Luminous flux (lm) | Radiant flux (W) | Lumens are weighted by the photopic response of the human eye; watts are not. For UV and IR emitters the lumen figure is misleading or zero. |
| Efficacy (lm/W) | Photon efficacy (umol/J) | Same idea, different weighting. Horticultural buyers ask for umol/J because plant response peaks outside the photopic curve. |
| Dominant wavelength | Peak wavelength | Dominant is the perceived hue and can differ from the peak of the spectrum, particularly for phosphor-converted parts. |
| L70 | Warranty | L70 is a photometric projection. A warranty is a commercial commitment that may also cover colour shift, driver failure and labour. |
| Binning | Sorting | Binning is measurement and grouping at the factory. Sorting is what a distributor or fixture maker does afterwards. Do not assume the second follows from the first. |
| Junction temperature | Case temperature | Junction is the die. Case is the solder point or the package underside. The difference is drive power multiplied by thermal resistance, and it is often 20 degrees or more. |
| Nominal current | Maximum current | Nominal is the condition at which the datasheet figures are quoted. Maximum is a survival limit, not a design target. |
| Luminous intensity | Luminous flux | Intensity is flux per unit solid angle and depends on the optics; flux is the total emitted. Comparing intensities across different beam angles is invalid. |
| Colour temperature | Colour rendering | A source can be the correct white point and still render colour badly. The two are independent axes. |
| RoHS compliance | Reliability | Restricting hazardous substances says nothing about lifetime or thermal performance. They are separate claims. |
7. How to use this glossary in a specification
Write the bin code, the test current and the test case temperature into the purchase specification, not just the nominal flux. A part number alone leaves the forward voltage bin, the chromaticity quadrangles and the LM-80 test condition open, and those three variables account for most of the difference between two quotations that look identical on the first page.
Where a specification references a standard, quote the revision. LM-80-21 and TM-21-19 replaced earlier editions with changed sampling requirements, and a projection made under the older edition is not directly comparable. The same discipline applies to safety and photobiological classifications, where the risk group depends on the measurement distance as well as on the source.
Finally, separate what is measured from what is modelled in the document itself. Put measured quantities, with their test conditions, in one table and projected quantities, with their model and assumptions, in another. Buyers who know which is which negotiate faster, and disputes that reach the factory floor are almost always about a projected figure that was read as a measured one.
8. Where these terms appear in the QUEENDOM catalogue
The SMD families in this glossary map to the following part numbers: 0807 and 2121 addressable packages in the J-16 group, 3528 and 3535 multi-colour and white packages in the J-17 and J-18 groups, and 5050 multi-colour packages in the J-19 group. The 3535 ceramic high-power family is documented in J-01 through J-04 depending on flux bin and CRI. Horticultural white and far-red packages are covered by Z-01 to Z-04 in the lighting catalogue, and the UV LED family in the 275 nm to 405 nm range is documented separately in the UV group.
9. Related reading and next steps
Two companion pages extend this vocabulary. The series resistor and array calculator works through the electrical terms above with numbers, and the PPFD to DLI calculator applies the horticultural units to a real grow-room design. Both are linked below, and both are written to be used alongside this page rather than instead of it.
For bin allocation, LM-80 reports or incoming inspection limits on a specific part number, send the package size, drive current and target CRI, and our component engineering group will return the current production bin distribution and the applicable test report.
10. Contact and specification review
QUEENDOM operates an ISO 9001 production line with in-house binning, and can supply LM-80 data, chromaticity quadrangle definitions and thermal resistance measurements for any catalogue part. Send the drive condition and the environment, and we will review the specification for the terms that most often cause disputes at incoming inspection.
Failure Mechanisms and Standards Glossary
Reliability terms become concrete when tied to the mechanisms they describe and the standards that measure them. The curve sketches the classic bathtub: early infant-mortality failures from process defects, a long stable useful-life region, and wear-out as packaging materials exhaust their fatigue life.
| Mechanism | Driver | Field symptom | Countermeasure |
|---|---|---|---|
| Sulfurization | Silver reacts with sulfur-bearing atmospheres | Blackening, flux loss | Conformal coating, silicone seal |
| ESD | Latent junction damage | Leakage, dark spots | HBM 2 kV handling discipline, TVS parts |
| EOS | Overcurrent transients | Burnt bond, open circuit | Current limit, surge protection |
| Delamination | CTE mismatch, poor die attach | Rising Tj, flux droop | Verified die-attach voiding limits |
| Wire-bond fatigue | Thermal cycling amplitude | Intermittent, open after cycles | Demand temperature-cycling data |
| Phosphor aging | Heat, moisture, UV | Lumen loss, color shift | Derate Tj, low-moisture packaging |
The standards below appear on most datasheets; knowing what each does and does not promise prevents most specification disputes.
| Standard | What it covers |
|---|---|
| LM-80 | 6,000 h (option 10,000 h) lumen-maintenance test on the LED package |
| TM-21 | Extrapolation method for LM-80 data, capped at 6x test duration |
| LM-79 | Electrical and photometric measurement of finished luminaires |
| ANSI C78.377 | Chromaticity binning of white light |
| IEC 62031 | Safety requirements for LED modules |
| JESD22-A114 | HBM ESD classification behind the familiar 2 kV rating |















