Most specification arguments between an LED supplier and a fixture designer are not really arguments about physics. They are arguments about vocabulary. Two engineers say “bin” and mean different things; one says “lifetime” and means L70 while the other means the warranty period. This glossary collects the terms that appear in QUEENDOM datasheets, qualification reports and incoming inspection documents, defined the way our component engineering group uses them in writing. Every entry is written to be usable in a purchase order, not just readable, and where a term has a standard behind it the revision number is given.

1. Package and chip terms

Package vocabulary decides the manufacturing process long before it decides the optics. The package geometry sets the reflow profile, the stencil aperture, the pick-and-place nozzle and the inspection method, and in a high-volume line those choices are harder to reverse than the choice of LED die.

TermDefinitionWhere it matters
SMDSurface-mount device. An LED whose terminals are soldered to pads on the board surface rather than through holes.Reflow profile, pad geometry, thermal via design
CSPChip-scale package. A package whose footprint is close to the bare die area, typically under 1.2 times the die in each dimension.High-density arrays where board area is the constraint
COBChip-on-board. Multiple dies mounted directly on a substrate and covered with a single phosphor layer.High-flux luminaires, uniform emitting surface
PLCCPlastic leaded chip carrier. A package with a moulded plastic body and metal leads, common in 3528, 3535 and 5050 sizes.General indication and backlighting
Flip-chipA die mounted face-down so light exits through the sapphire substrate and no wire bond shadows the emitting area.Very high current density, automotive forward lighting
DieThe semiconductor chip itself, before packaging and phosphor conversion.Bin definition, thermal resistance chain
Dominate wavelengthPeak of the spectral power distribution for a monochromatic LED, reported in nanometres.Colour sorting for RGB and signalling
Peak wavelengthThe single wavelength of maximum spectral power.UV and IR emitter selection
Bond wireThe fine gold or copper wire that connects the die top contact to the package lead frame.A shock and vibration failure path in automotive and industrial use
Moulding compoundThe epoxy or silicone body that encapsulates the die and the bond wires.Silicone resists UV and heat better than epoxy, which matters above 1 W
Lead frameThe metal structure that carries the die and forms the solder terminals.Plating quality drives sulfurization resistance
SubstrateThe ceramic or metal core board under a high-power or COB emitter.Aluminium nitride and alumina sets the thermal resistance floor
Reflow profileThe time and temperature schedule that melts solder paste to attach the package.Peak temperature is capped by the package moisture sensitivity level
MSLMoisture sensitivity level, the floor time a package may spend out of dry storage before baking is required.Popcorning cracks at reflow if the level is exceeded

2. Electrical terms

The electrical vocabulary is small, but two of the entries below cause more field failures than any other single term: forward voltage and thermal resistance. Both are distributions rather than points, and both are quoted at a test condition that the application may not match.

TermDefinitionTypical value
Forward voltage (Vf)Voltage across the LED at a stated forward current and junction temperature.2.8 – 3.4 V for white and blue at 60 mA
Forward current (If)Continuous current the LED is specified to carry.20 mA nominal for 20 mA-class SMD chips
Reverse leakageCurrent that flows when the LED is reverse biased below its breakdown voltage.Under 10 microamps at -5 V
ESD withstandHuman-body-model voltage the package survives without a forward voltage shift.2 kV HBM for standard SMD
Thermal resistance (Rth j-sp)Junction to solder point thermal resistance, the number that links drive current to junction temperature.8 – 15 K/W for 3535 ceramic
DeratingThe reduction in permitted current as ambient or solder point temperature rises.Published as a curve or a linear derating factor
Binning currentThe exact current at which luminous flux and forward voltage were measured for the bin.Often 60 mA or 150 mA depending on package size
Drive currentThe current the application actually applies, which may differ from the binning current.Re-read the flux table at the application current
Pulsed operationDrive with a low duty cycle and short pulse width, used to measure high currents without heating the die.The basis of peak current claims in RGB and IR datasheets
Constant current driverA driver that holds output current fixed and lets output voltage float within a compliance window.Preferred once a branch carries more than three or four LEDs
Constant voltage driverA driver that holds output voltage fixed; current is set by series resistance or an internal regulator.Simplest topology, worst current spread across bins

3. How binning actually works

Binning is the process of measuring production parts and sorting them into discrete groups with a narrow spread on one parameter. Three axes are used for white LEDs: luminous flux, forward voltage and chromaticity. A reel is described by one code from each axis, so a full part number carries three bin letters or numbers plus the package and CRI designation. Two parts that look the same in a catalogue can therefore be four bins apart and behave differently in a fixture that drives them hard.

Forward voltage bin yield distribution for a 3535 white LED at 60 milliamps Forward voltage bin (V), 3535 RGB white channel at 60 mA Parts per bin (thousands) 2.80 2.90 3.00 3.10 3.20 3.30 3.40 3.50 0 20 40 Sorted yield curve (typical)
Forward voltage bins are sorted at test and sold as discrete part numbers. The typical yield peak sits two bins above the minimum, so a design that assumes the minimum forward voltage will over-current on most of the delivered parts. Always design to the centre of the bin you purchase and confirm the bin code on the reel label.

Two consequences follow from this chart. First, the yield from a production run is not uniform; the peak of the distribution sits two bins above the minimum, so a buyer who orders the lowest bin is ordering the tail of the distribution and may face allocation pressure. Second, the forward voltage spread within one bin is still wide enough to matter if you drive LEDs from a fixed voltage rail with a single series resistor. That is why constant-current drivers are preferred once the branch count exceeds a handful.

A third consequence is commercial rather than technical. When a specification names only a nominal flux, the supplier is free to allocate any of several adjacent bins, and this is the single most common source of a first-article dispute. Naming the bin code, and accepting a stated tolerance around it, removes the ambiguity before the order is placed. Where a design cannot accept the full bin range, request a sub-bin or pay for the sorting; both are legitimate commercial options and both should be written into the agreement rather than assumed.

4. Reliability and lifetime terms

The reliability vocabulary is the one most often misused in marketing copy. An LM-80 report is a measurement; a TM-21 projection is a model fitted to that measurement; an L70 figure is the output of the model. Each step adds an assumption, and a comparison between two suppliers is only valid if the assumptions match.

TermDefinitionStandard basis
LM-80Test method for measuring lumen maintenance of LED packages, arrays and modules at three case temperatures over at least 6000 hours.IES LM-80-21
TM-21Method that projects LM-80 data beyond the test duration to a target hour count.IES TM-21-19
L70 / L80 / L90The hours at which the light output falls to 70, 80 or 90 percent of the initial value.Projected by TM-21 from LM-80 data
Lumen maintenanceRetained luminous flux at a given time and condition, expressed as a percentage of initial.LM-80 measured points
SulfurizationSilver-plated lead discolouration caused by sulphur compounds in the ambient, which raises contact resistance and drops flux.Internal qualification and field return analysis
Thermal cyclingRepeated excursion between low and high temperature to expose solder joint and die-attach fatigue.JESD22-A104
High-temperature operating lifeContinuous operation at elevated temperature to accelerate wear-out mechanisms.JESD22-A108
PPF / PPFDPhotosynthetic photon flux (micromoles per second) and its density (micromoles per second per square metre).ANSI/ASABE S640
Interpolation vs extrapolationReading between two measured points versus projecting beyond the last one. Only the first is a measurement.TM-21 restricts how far a projection may run beyond the data
Accelerated life testA test run above the rated condition so that failures appear in a practical time window.Needs a validated acceleration model to translate back
Field return analysisTeardown and measurement of parts that failed in service, the only true check on an accelerated test.Feeds the next qualification revision
Weibull distributionThe statistical model most often fitted to time-to-failure data to estimate a population failure rate.Distinguishes infant mortality from wear-out
Relative luminous flux against junction temperature at three drive currents L70 threshold 55 70 85 100 115 0 70 100 Junction temperature (degrees C) Relative luminous flux (percent) Green – LM-80 drive current Amber – 1.4x nominal current Blue – 2.0x nominal current
Flux falls with junction temperature and the fall is steeper as drive current rises. The dashed rule is the L70 threshold at 70 percent of initial flux. A fixture that runs a 3535 LED at two times nominal current crosses L70 near 85 degrees C junction, which is why the thermal path, not the LED, usually sets the lifetime claim in a specification.

The practical reading of this pair of charts is that the lifetime number on a datasheet is a conditional statement, not a property of the LED. Change the drive current or the thermal path and the same part number delivers a different L70. When comparing two suppliers, compare the test current and case temperature as well as the projected hours, or the comparison is meaningless.

5. Colour and optical terms

Colour terminology contains a trap that catches even experienced buyers: a single averaged index conceals the one sample that matters most. The average is useful for a broad comparison and useless for retail, hospitality and broadcast applications where the red rendering of skin, food and fabric is the point of the specification.

TermDefinitionNotes
CRI (Ra)Colour rendering index averaged over eight test colour samples, scaled so a reference illuminant scores 100.Use R9 separately; it is not part of Ra
R9Rendering score for a saturated red sample, the sample most LED phosphor systems fail.Retail and hospitality specifications commonly demand R9 above 50
CCTCorrelated colour temperature, the temperature of the blackbody whose colour is nearest the source.2700 K to 6500 K for general lighting
SDCMStandard deviation of colour matching, the radius of the ellipse on the chromaticity diagram within which parts are accepted.3-step is the usual retail grade
ChromaticityThe x, y coordinate of the source on the CIE 1931 diagram.Bin definitions are polygons in this space
MacAdam ellipseThe contour of just-noticeable colour difference around a target point.Quadrangles are fitted inside a chosen ellipse
Radiant fluxTotal optical power emitted, in watts, without weighting for human vision.The correct metric for UV, IR and horticultural emitters
Photon efficacyMicromoles of photons per joule of input energy.The horticultural equivalent of lumens per watt
Beam angleThe included angle at which intensity falls to half its peak value.Related to, but not the same as, the viewing angle of a bare emitter
Colour shift over lifeDrift in chromaticity as the phosphor and the die age at different rates.Quoted as a delta uv limit alongside the lumen figure
Flicker percentModulation depth of the light output under an AC-derived drive.Relevant for camera capture, not only for visual comfort
Photobiological safetyThe classification of a source by the risk it poses to skin and eyes.IEC 62471 assigns the risk group

6. Terms that are commonly confused

The entries below are the pairs that generate the most support tickets and the most wasted design effort, because in each case the two terms are close enough to be used interchangeably in conversation and far enough apart to change the outcome of a design or a contract.

Term ATerm BThe distinction
Luminous flux (lm)Radiant flux (W)Lumens are weighted by the photopic response of the human eye; watts are not. For UV and IR emitters the lumen figure is misleading or zero.
Efficacy (lm/W)Photon efficacy (umol/J)Same idea, different weighting. Horticultural buyers ask for umol/J because plant response peaks outside the photopic curve.
Dominant wavelengthPeak wavelengthDominant is the perceived hue and can differ from the peak of the spectrum, particularly for phosphor-converted parts.
L70WarrantyL70 is a photometric projection. A warranty is a commercial commitment that may also cover colour shift, driver failure and labour.
BinningSortingBinning is measurement and grouping at the factory. Sorting is what a distributor or fixture maker does afterwards. Do not assume the second follows from the first.
Junction temperatureCase temperatureJunction is the die. Case is the solder point or the package underside. The difference is drive power multiplied by thermal resistance, and it is often 20 degrees or more.
Nominal currentMaximum currentNominal is the condition at which the datasheet figures are quoted. Maximum is a survival limit, not a design target.
Luminous intensityLuminous fluxIntensity is flux per unit solid angle and depends on the optics; flux is the total emitted. Comparing intensities across different beam angles is invalid.
Colour temperatureColour renderingA source can be the correct white point and still render colour badly. The two are independent axes.
RoHS complianceReliabilityRestricting hazardous substances says nothing about lifetime or thermal performance. They are separate claims.

7. How to use this glossary in a specification

Write the bin code, the test current and the test case temperature into the purchase specification, not just the nominal flux. A part number alone leaves the forward voltage bin, the chromaticity quadrangles and the LM-80 test condition open, and those three variables account for most of the difference between two quotations that look identical on the first page.

Where a specification references a standard, quote the revision. LM-80-21 and TM-21-19 replaced earlier editions with changed sampling requirements, and a projection made under the older edition is not directly comparable. The same discipline applies to safety and photobiological classifications, where the risk group depends on the measurement distance as well as on the source.

Finally, separate what is measured from what is modelled in the document itself. Put measured quantities, with their test conditions, in one table and projected quantities, with their model and assumptions, in another. Buyers who know which is which negotiate faster, and disputes that reach the factory floor are almost always about a projected figure that was read as a measured one.

8. Where these terms appear in the QUEENDOM catalogue

The SMD families in this glossary map to the following part numbers: 0807 and 2121 addressable packages in the J-16 group, 3528 and 3535 multi-colour and white packages in the J-17 and J-18 groups, and 5050 multi-colour packages in the J-19 group. The 3535 ceramic high-power family is documented in J-01 through J-04 depending on flux bin and CRI. Horticultural white and far-red packages are covered by Z-01 to Z-04 in the lighting catalogue, and the UV LED family in the 275 nm to 405 nm range is documented separately in the UV group.

9. Related reading and next steps

Two companion pages extend this vocabulary. The series resistor and array calculator works through the electrical terms above with numbers, and the PPFD to DLI calculator applies the horticultural units to a real grow-room design. Both are linked below, and both are written to be used alongside this page rather than instead of it.

For bin allocation, LM-80 reports or incoming inspection limits on a specific part number, send the package size, drive current and target CRI, and our component engineering group will return the current production bin distribution and the applicable test report.

10. Contact and specification review

QUEENDOM operates an ISO 9001 production line with in-house binning, and can supply LM-80 data, chromaticity quadrangle definitions and thermal resistance measurements for any catalogue part. Send the drive condition and the environment, and we will review the specification for the terms that most often cause disputes at incoming inspection.

Failure Mechanisms and Standards Glossary

Reliability terms become concrete when tied to the mechanisms they describe and the standards that measure them. The curve sketches the classic bathtub: early infant-mortality failures from process defects, a long stable useful-life region, and wear-out as packaging materials exhaust their fatigue life.

Schematic failure-rate bathtub for an SMD LED population0246810012345Time in service (schematic units)Failure rate (schematic)useful life (datasheet region)wear-outinfant mortality
Figure. Schematic failure-rate bathtub for an SMD LED population. Datasheet lifetime claims apply to the flat middle region; TM-21 projections are valid only inside it.
MechanismDriverField symptomCountermeasure
SulfurizationSilver reacts with sulfur-bearing atmospheresBlackening, flux lossConformal coating, silicone seal
ESDLatent junction damageLeakage, dark spotsHBM 2 kV handling discipline, TVS parts
EOSOvercurrent transientsBurnt bond, open circuitCurrent limit, surge protection
DelaminationCTE mismatch, poor die attachRising Tj, flux droopVerified die-attach voiding limits
Wire-bond fatigueThermal cycling amplitudeIntermittent, open after cyclesDemand temperature-cycling data
Phosphor agingHeat, moisture, UVLumen loss, color shiftDerate Tj, low-moisture packaging

The standards below appear on most datasheets; knowing what each does and does not promise prevents most specification disputes.

StandardWhat it covers
LM-806,000 h (option 10,000 h) lumen-maintenance test on the LED package
TM-21Extrapolation method for LM-80 data, capped at 6x test duration
LM-79Electrical and photometric measurement of finished luminaires
ANSI C78.377Chromaticity binning of white light
IEC 62031Safety requirements for LED modules
JESD22-A114HBM ESD classification behind the familiar 2 kV rating

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