7070 LEDs | High Power LED
OVERVIEW
Queendom 7070 LED is a multi-chip high-power LED in a high-power ceramic package; provides high brightness in an ultra-rugged package, composed of multiple chips, available for monochromatic light, RGB, RGBW, or white light; quad-core parallel design available Designed for cost-effective single light and directional luminaires, this product conducts heat 10 times faster than analog lumens.
PERFORMANCE
Product performance of Queendom 7070 LEDs | High Power LED at test current, Tj=25°C Flux and Tj=85°C for R9 and CRI
| Ø Absolute Maximum Rating(At TA=25°C) | Symbol | Ratings | Units |
| Parameter[Number of chips 4*3-5w LED] | PD | 4/16 | W |
| Continuous Forward Current | IF | 350/700/1500 | mA |
| Peak Forward Current ＊1 | IFP | 4 Series@1500 | mA |
| Reverse Voltage | VR | 5 | V |
| Thermal Resistance Junction To Board | RΘJ-B | 8 | °C/W |
| Operating Temperature Range | TOPR | Minus 30°C To plus 60°C | |
| Storage Temperature Range | TSTG | Minus 40°C To plus 80°C | |
| Manual Solding Temperature | TSOL | 260°C± 10°C For 3~5 Seconds | |
| ESD Sensitivity | ESD | 2000V HBM | |
| Junction Temperature | Tj | 125 | °C |
Notes:
- Derate linearly as shown in derating
- Duty Factor = 10%, Frequency = 1 kHz
PRODUCT
Table 2 Product performance of QUEENDOM 7070 LEDs | High Power LED Colors at 350 mA and 700mA and 1200mA, Tj=25ºC,Flux and Tj=85°C for R9 and CRI
| Product No. | Power/W | Wavelenght(nm) | IF(mA) TEST | Φe(MCD/LM) | CRI | VF (V) Typ. | Reverse current | deg 2Ө 1/2 | Lens Type | Part No. |
| SP7070R311CFA | 3W | 625 | 350 | 20-40LM/W | / | 2 | <10ua | 120 | Clear | 8541401000HP03 |
| SP7070Y311CFA | 3W | 585 | 350 | 30-60LM/W | / | 2 | <10ua | 120 | Clear | 8541401000HP04 |
| SP7070G311CFB | 3W | 525 | 350 | 80-120LM/W | / | 3 | <10ua | 120 | Clear | 8541401000HP05 |
| SP7070B311CFB | 3W | 465 | 350 | 20-35LM/W | / | 3 | <10ua | 120 | Clear | 8541401000HP06 |
| SP7070R311CIC | 6W | 625 | 700 | 20-40LM/W | / | 4 | <10ua | 120 | Clear | 8541401000HP07 |
| SP7070Y311CIC | 6W | 585 | 700 | 30-60LM/W | / | 4 | <10ua | 120 | Clear | 8541401000HP08 |
| SP7070G311CIE | 6W | 525 | 700 | 80-120LM/W | / | 6 | <10ua | 120 | Clear | 8541401000HP09 |
| SP7070B311CIE | 6W | 465 | 700 | 20-35LM/W | / | 6 | <10ua | 120 | Clear | 8541401000HP10 |
| SP7070R311CJE | 9W | 625 | 1000 | 20-40LM/W | / | 6 | <10ua | 120 | Clear | 8541401000HP11 |
| SP7070Y311CJE | 9W | 585 | 1000 | 30-60LM/W | / | 6 | <10ua | 120 | Clear | 8541401000HP12 |
| SP7070G311CJH | 9W | 525 | 1000 | 80-120LM/W | / | 9 | <10ua | 120 | Clear | 8541401000HP13 |
| SP7070B311CJH | 9W | 465 | 1000 | 20-35LM/W | / | 9 | <10ua | 120 | Clear | 8541401000HP14 |
| SP7070R311CMK | 12W | 625 | 1200 | 20-40LM/W | / | 12 | <10ua | 120 | Clear | 8541401000HP15 |
| SP7070Y311CMK | 12W | 585 | 1200 | 30-60LM/W | / | 12 | <10ua | 120 | Clear | 8541401000HP16 |
| SP7070G311CMK | 12W | 525 | 1200 | 80-120LM/W | / | 12 | <10ua | 120 | Clear | 8541401000HP17 |
| SP7070B311CMK | 12W | 465 | 1200 | 20-35LM/W | / | 12 | <10ua | 120 | Clear | 8541401000HP18 |
| SP7070W311CFB | 6W | 3000 | 700 | 90-130LM/W | 80 | 6 | <10ua | 120 | Clear | 8541401000HP19 |
| SP7070W311CFB | 6W | 4000 | 700 | 90-130LM/W | 80 | 6 | <10ua | 120 | Clear | 8541401000HP20 |
| SP7070W311CFB | 6W | 5000 | 700 | 90-130LM/W | 80 | 6 | <10ua | 120 | Clear | 8541401000HP21 |
| SP7070W311CMK | 12W | 3000 | 1200 | 90-130LM/W | 80 | 12 | <10ua | 120 | Clear | 8541401000HP22 |
| SP7070W311CMK | 12W | 4000 | 1200 | 90-130LM/W | 80 | 12 | <10ua | 120 | Clear | 8541401000HP23 |
| SP7070W311CMK | 12W | 5000 | 1200 | 90-130LM/W | 80 | 12 | <10ua | 120 | Clear | 8541401000HP24 |
Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response
2θ1/2 is the o-axis angle where the luminous intensity is 1⁄2 the peak
The dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
FEATURES
Packaging form: SMD packaging -ceramic craft
Main chips: CREE, Osram, Epistar, Sanan, chip materials such as gallium arsenide (GaAs), sapphire (Al2O3), etc.
Chip range: size 30*30mil -45*45mil
Package wires: The leads are made of high-purity 99.99% gold wire materials, such as gold (Au) or copper (Cu), to ensure good electrical conductivity and reliable connection.
Bracket material: The materials include PCT, PPA, and EMC. Conventional PCT material EMC (aluminum alloy or copper alloy. The bracket is covered with an electrical insulation layer, such as ceramic or high-temperature plastic)
Packaging glue: silicone + resin glue
Display Index: available in 70CRI, 80CRI and 90CRI
Lighting method: single color, Multi-Color LED, Bi-Color, RGB, color.
Colloidal color: water clear, yellow Diffused
Compatible with multiple voltage configurations: LED has multiple voltage configurations of 3V, 6V, and 24V, and is compatible with low-cost and high-efficiency drivers
BENEFITS
High brightness, low power consumption and long life
Easy to install: small size, light weight, convenient installation
Excellent heat dissipation design: Use low Rth materials for effective heat dissipation design to improve efficiency. Thermal color positioning ensures colors are within the ANSI bin range at 85°C.
Good color uniformity: Colored light adopts 2.5nm binning structure, warm white light 200k/PIN, and pure white light 500k/PIN, which ensures excellent color uniformity.
Compatible with automatic placement equipment
Compatible with infrared and vapor phase reflow soldering processes
APPLICATION
Indoor and outdoor lighting such as home lighting, commercial lighting and street lighting
Commonly used in products such as displays, and billboards
Automobile: instrument panel, brake light, turn signal.
Biomedical optics, instrumentation and equipment testing
Status indicators: consumer electronics and industrial electronics.
Security, infrared monitoring, night vision.
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