3020 LEDs|3020 High-Power CSP LEDs
Overview
The 3020 High-Power CSP LED (3.0 mm × 2.0 mm) represents the perfect balance between compact footprint and high-intensity output. Unlike standard low-power indicators, this series utilizes advanced Chip Scale Package (CSP) technology with series-connected die structures, enabling operation at 1000 mA (1A) with a forward voltage of 5.5V – 7.0V.
Delivering up to 640 lumens with an efficacy of 130 lm/W, the 3020 HP series is engineered for space-constrained applications requiring superior brightness and thermal stability. Its robust ceramic/composite substrate ensures excellent heat dissipation, making it ideal for automotive interior lighting, ultra-thin panel lights, horticultural lighting, and high-density backlighting.
Available Models & Part Numbers
Table: Typical optical and electrical characteristics (Tj = 25°C, If = 1000 mA)
| Model | Rank Code | CCT (K) | Min CRI (Ra) | Flux Min (lm) | Flux Max (lm) | Vf Min (V) | Vf Max (V) | Efficacy (lm/W) | Angle (2θ½) | Test Current (mA) | Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|
| HP3020WW2WG | HP0800 | 2700K | 80 | 400 | 640 | 5.5 | 7.0 | 130 | 120° | 1000 | 8541401000HP0800 |
| HP3020WV2WG | HP0801 | 3000K | 80 | 400 | 640 | 5.5 | 7.0 | 130 | 120° | 1000 | 8541401000HP0801 |
| HP3020WU2WG | HP0802 | 3500K | 80 | 400 | 640 | 5.5 | 7.0 | 130 | 120° | 1000 | 8541401000HP0802 |
| HP3020WT2WG | HP0803 | 4000K | 80 | 400 | 640 | 5.5 | 7.0 | 130 | 120° | 1000 | 8541401000HP0803 |
| HP3020WR2WG | HP0804 | 5000K | 80 | 400 | 640 | 5.5 | 7.0 | 130 | 120° | 1000 | 8541401000HP0804 |
| HP3020WQ2WG | HP0805 | 5700K | 80 | 400 | 640 | 5.5 | 7.0 | 130 | 120° | 1000 | 8541401000HP0805 |
| HP3020WP2WG | HP0806 | 6500K | 80 | 400 | 640 | 5.5 | 7.0 | 130 | 120° | 1000 | 8541401000HP0806 |
| HP3020WX2WG* | HP0807 | 7600K | 80 | 400 | 640 | 5.5 | 7.0 | 130 | 120° | 1000 | 8541401000HP0807 |
*Note: Model code for 7600K corrected for clarity. Flux values represent the typical range between Minimum and Maximum bins. Actual performance may vary based on specific bin selection.
Features
- High Power Density: Delivers up to 640 lumens from a compact 3.0×2.0mm package at 1000 mA drive current.
- High Voltage Architecture: Operates at 5.5V – 7.0V, reducing current stress on PCB traces compared to low-voltage alternatives while maintaining high efficiency.
- Superior Efficacy: Achieves typ. 130 lm/W, minimizing energy consumption in battery-powered or energy-sensitive applications.
- CSP Reliability: Flip-chip design eliminates wire bonds, reducing failure rates under thermal cycling and mechanical stress.
- Wide Color Range: Available from Warm White (2700K) to Cool Daylight (7600K) with consistent CRI ≥ 80.
- Thermal Stability: Optimized for high-temperature environments with excellent heat dissipation through the ceramic substrate.
- SMT Compatible: Designed for standard reflow soldering processes, ensuring high-speed automated assembly yield.
Benefits
- Available Colors (Monochrome):
- Red, Orange, Yellow, Green, Blue
- Wavelengths: Customizable based on application (e.g., 625nm Red, 470nm Blue)
- Chip Materials:
- InGaAlP (LGAP): For Red, Orange, Yellow, Amber
- GaAs / GaAsP: For High-efficiency Red/Orange
- InGaN (GaN/GaAlAs): For Green, Blue, White, UV
- Chip Brands (Compatible/Selected):
- Cree, Toyoda Gosei, Bridgelux, Osram, Sanan, Epistar
- Chip Dimensions:
- Typical: 40 × 40 mil, 50 × 50 mil and larger high-power dies.
- Substrate: High-thermal conductivity Ceramic or EMC (Epoxy Molding Compound) with copper frame.
- Operating Temperature: -40°C to +85°C
- Storage Temperature: -40°C to +100°C
- Maximum Junction Temperature (Tj): 125°C
- Thermal Resistance (Rθ J-C): < 10 °C/W (Optimized for 3W dissipation)
- Moisture Sensitivity Level (MSL): MSL 3
- RoHS: Compliant (Lead-free & Halogen-free)
- REACH: Compliant
- Photobiological Safety: EN 62471 (Risk Group 1 or 2 depending on application)
- ESD Protection: HBM ≥ 2000V
Applications
The 3020 High-Power CSP LED is engineered for applications demanding high brightness in a mid-power footprint:
- Automotive Lighting: Interior ambient lighting, dashboard clusters, door handle lights, and matrix DRL modules.
- General Lighting: Ultra-thin LED panel lights, downlights, T5/T8 tube replacements, and linear lighting strips.
- Horticultural Lighting: Compact grow lights for indoor farming and plant bars (specific spectral bins available).
- Consumer Electronics: High-brightness camera flashes, wearable safety lights, and premium device indicators.
- Commercial Display: Backlighting for LCD signage, vending machines, and architectural accent lighting.
- Medical & Industrial: Portable diagnostic devices, machine vision illumination, and control panel backlighting.
Design Note: Due to the high power density (up to ~7W per component), proper thermal management using MCPCB (Metal Core PCB) or active cooling is recommended to maintain junction temperature (Tj) below 85°C for optimal lifespan.




