What is the typical lifespan of this product?

The product is designed for long-term industrial use, with a typical lifespan of over 50,000 hours.

Do you support OEM or custom specifications?

Yes, we support OEM, ODM, and custom technical specifications based on project requirements.

What certifications are available?

Certifications vary by model and may include CE, RoHS, LM-80, and ISO-compliant manufacturing.

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2016 LEDs

Name: 2016 LEDs
Brand: QUEENDOM

Technical Specifications

2016 High-Power CSP LEDs

Package Size: 2.0 mm × 1.6 mm (CSP / Chip Scale Package)
Colors Available:

White (Phosphor-Converted): 3000K, 3500K, 4000K, 5000K, 6500K (Customizable 2700K–7000K)
Chip Options: Compatible with high-efficiency chips from Bridgelux, Cree, Osram, Sanan, and Epistar (High-voltage or series-connected die structures for 2016 footprint)

Forward Voltage (Vf):

Range: 6.0 V – 12.0 V (Multi-die series structure within 2016 package)
Test Condition: @ 350 mA – 1000 mA

Operating Current:

Standard Drive: 350 mA – 700 mA (Continuous)
High-Power Drive: Up to 1000 mA (1A) (Continuous, requires high-performance MCPCB and active thermal management)
- Note: 1500mA is generally not recommended for 2016 package due to extreme current density; 1000mA is the industry high-power standard for this size.

Typical Power Consumption:

3W Class: ~3.0 W – 4.5 W (@ 6–9 V, 700mA)
5W Class (Max): ~5.0 W – 6.0 W (@ 6–12 V, 1000mA)
- (Revised from 10W/15W to match 2016 physical thermal limits)

Luminous Efficacy & Flux (White):

Efficacy: 110 – 160 lm/W (High binning selection)
Luminous Flux (@ 700mA): 450 – 700 lm
Luminous Flux (@ 1000mA): 650 – 950 lm
- (Note: While lower total lumens than 1860 due to size, the lumens per mm² density is extremely high)

Color Rendering Index (CRI):

Standard: Ra ≥ 80
High CRI Option: Ra ≥ 90, R9 > 50 (Available upon request)

Viewing Angle:

Beam Angle: 120° – 140° (Lambertian emission, no secondary lens needed)
Encapsulation: Colorless transparent silicone with ceramic phosphor layer

Category: High-Power LED Tags: 2016 LEDs, new led product

Description

2016 LEDs｜High-Power CSP LEDs | Compact 1A Drive Solutions

Overview

The 2016 High-Power CSP LED redefines miniaturization in high-intensity lighting. Measuring just 2.0 mm × 1.6 mm, this Chip Scale Package (CSP) delivers exceptional performance with a drive current up to 1000 mA (1A) and luminous flux ranging from 240 to 400 lumens.

Unlike traditional low-power SMD 2016 indicators, this series utilizes advanced flip-chip technology and ceramic/composite substrates to achieve high efficacy (130 lm/W) and superior thermal management in an ultra-compact footprint. It is the ideal solution for space-constrained applications requiring intense brightness, such as miniature flashlights, endoscopic medical lighting, high-density automotive arrays, and wearable illumination.

Available Models & Part Numbers

Table: Typical optical and electrical characteristics (Tj = 25°C, If = 1000 mA)

Model	Rank Code	CCT (K)	Min CRI (Ra)	Flux Min (lm)	Flux Max (lm)	Vf Min (V)	Vf Max (V)	Efficacy (lm/W)	Angle (2θ½)	Test Current (mA)	Part Number
HP2016WW2WF	HP0700	2700K	80	240	400	2.8	3.4	130	120°	1000	8541401000HP0700
HP2016WV2WF	HP0701	3000K	80	240	400	2.8	3.4	130	120°	1000	8541401000HP0701
HP2016WU2WF	HP0702	3500K	80	240	400	2.8	3.4	130	120°	1000	8541401000HP0702
HP2016WT2WF	HP0703	4000K	80	240	400	2.8	3.4	130	120°	1000	8541401000HP0703
HP2016WR2WF	HP0704	5000K	80	240	400	2.8	3.4	130	120°	1000	8541401000HP0704
HP2016WQ2WF	HP0705	5700K	80	240	400	2.8	3.4	130	120°	1000	8541401000HP0705
HP2016WP2WF	HP0706	6500K	80	240	400	2.8	3.4	130	120°	1000	8541401000HP0706
HP2016WX2WF*	HP0707	7600K	80	240	400	2.8	3.4	130	120°	1000	8541401000HP0707

*Note: Model code for 7600K corrected for clarity. Flux values represent the typical range between Minimum and Maximum bins. Actual performance may vary based on specific bin selection.

Features

Ultra-High Power Density: Delivers up to 400 lumens from a tiny 2.0×1.6mm package, driven at 1000 mA.
Superior Efficacy: Achieves typ. 130 lm/W, minimizing power consumption while maximizing brightness.
CSP Technology: Chip Scale Package design eliminates wire bonds, reducing thermal resistance and improving reliability under high-current stress.
Compact Footprint: Enables ultra-slim and lightweight designs for portable and wearable devices where space is critical.
Wide Color Range: Available from Warm White (2700K) to Cool Daylight (7600K) with consistent CRI ≥ 80.
SMT Compatible: Designed for standard reflow soldering processes, ensuring high-speed automated assembly.
Robust Thermal Performance: Optimized structure dissipates heat efficiently, maintaining stable light output over long operational hours.

Benefits

Thermal Characteristics:

Substrate: Ceramic Alumina (AlN) or High-Thermal Composite with Eutectic Bonding (Critical for 2016 HP)
Operating Temperature: −40°C to +85°C (Ambient)
Maximum Junction Temperature (Tj): Recommended ≤ 125°C (Strict thermal control required due to small footprint)

Lifetime:L70/B50: ≥50,000 hours @ Tj ≤ 85°C (Highly dependent on PCB thermal design)
Compliance & Certifications:RoHS, REACH, EN62471 (Photobiological Safety), CE, AEC-Q102 (Automotive Grade Available)

Applications

The 2016 High-Power CSP LED is engineered for applications demanding extreme brightness in minimal space:

Portable Lighting: Miniature flashlights, keychain lights, and EDC (Everyday Carry) tools.
Medical Devices: Endoscopic lighting, dental curing lights, and surgical headlamps requiring sterile, compact sources.
Automotive Lighting: Matrix headlights, high-resolution DRLs, and interior ambient lighting arrays.
Consumer Electronics: Camera flashes for smartphones, wearable safety lights, and AR/VR headset illumination.
Industrial & Inspection: Borescopes, machine vision lighting, and handheld inspection lamps.
Specialty Signage: High-brightness pixel points for fine-pitch outdoor/indoor displays.