5050 RGBW LEDs

Technical Specifications

5050 RGBW LEDs

  • Package Size: 5.0 mm × 5.0 mm × 3.2 mm (with solder pads)
  • Substrate: Aluminum Nitride (AlN) ceramic – high thermal conductivity
  • Encapsulant: High-stability optical silicone
  • Chip Configuration: 4 independent dies (Red + Green + Blue + White), common anode or cathode
  • Operating Current (per channel):
    • Standard: 700 mA continuous (with adequate thermal management)
    • Pulsed: Up to 1000 mA (10% duty cycle, 100 Hz)
  • Forward Voltage (VF):
    • Red: 1.8 V – 2.4 V
    • Green / Blue / White: 2.8 V – 3.2 V
  • Viewing Angle: 120° (Lambertian emission); optional secondary optics for 90° or 150°
  • Thermal Resistance (RθJA): ~18°C/W (on FR-4 PCB with thermal vias)
  • Maximum Junction Temperature (Tj): 150°C
  • Lifetime (L70/B50): >50,000 hours @ Tj ≤ 85°C
  • Compliance: RoHS, REACH, IEC 62471 (Risk Group 1 – Exempt)
  • Optical Characteristics:
    • Red: 615–635 nm
    • Green: 520–530 nm
    • Blue: 460–470 nm
    • White: 2700K, 3000K, 3500K, 4000K, 5000K, 5700K, 6500K (±200K binning, CRI ≥80)
  • Typical Applications: Stage & entertainment lighting, architectural façade systems, retail & museum displays, commercial signage, industrial machine vision, and high-brightness color-tunable fixtures

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